Most Viewed Posts
The Physics and Technology of Metals
Understanding the conductivity of metals involves exploring their high electron mobility, ...
Majoranas: The Next Step in Quantum Computing
Microsoft’s Azure Quantum team is developing quantum chips using topological qubits, ...
Scaling of CMOS and its Issues
Dennard scaling revolutionized microelectronics by showing that reducing transistor size and ...
The Physics and Technology of Intrinsic Semiconductors
Semiconductors are materials with electrical properties between metals and insulators, governed ...
CMOS Process Steps: 3um to 1.25um
CMOS chips are made using a twin-well process, with precise tailoring ...
Exchange interaction
Electrons prefer parallel spins due to the quantum mechanical concept of ...
Latest Posts
Scaling of CMOS and its Issues
Dennard scaling revolutionized microelectronics by showing that reducing transistor size and voltage proportionally keeps power density constant. However, real-world limitations like subthreshold ...
CMOS Process Steps: 3um to 1.25um
CMOS chips are made using a twin-well process, with precise tailoring of each well starting from a lightly doped substrate. Key production ...
Basic nMOS Technology: Process Steps
NMOS fabrication involves key process steps like substrate selection, isolation, gate formation, and metallization. LOCOS isolation prevents unwanted current flow, while polysilicon ...
