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  • Scientists confirm one-dimensional electron behavior in phosphorus chains
    For the first time, researchers have shown that self-assembled phosphorus chains can host genuinely one-dimensional electron behavior. Using advanced imaging and spectroscopy techniques, they separated the signals from chains aligned in different directions to reveal their true nature. The findings suggest that squeezing the chains closer together could trigger a dramatic shift from semiconductor to […]
  • A tiny light trap could unlock million qubit quantum computers
    A new light-based breakthrough could help quantum computers finally scale up. Stanford researchers created miniature optical cavities that efficiently collect light from individual atoms, allowing many qubits to be read at once. The team has already demonstrated working arrays with dozens and even hundreds of cavities. The approach could eventually support massive quantum networks with […]
  • A strange in-between state of matter is finally observed
    When materials become just one atom thick, melting no longer follows the familiar rules. Instead of jumping straight from solid to liquid, an unusual in-between state emerges, where atomic positions loosen like a liquid but still keep some solid-like order. Scientists at the University of Vienna have now captured this elusive “hexatic” phase in real […]
  • New catalyst makes plastic upcycling 10x more efficient than platinum
    Scientists are finding new ways to replace expensive, scarce platinum catalysts with something far more abundant: tungsten carbide. By carefully controlling how tungsten carbide’s atoms are arranged at extremely high temperatures, researchers discovered a specific form that can rival platinum in key chemical reactions, including turning carbon dioxide into useful fuels and chemicals. Even more […]
  • Engineers just created a “phonon laser” that could shrink your next smartphone
    Engineers have created a device that generates incredibly tiny, earthquake-like vibrations on a microchip—and it could transform future electronics. Using a new kind of “phonon laser,” the team can produce ultra-fast surface waves that already play a hidden role in smartphones, GPS systems, and wireless tech. Unlike today’s bulky setups, this single-chip device could deliver […]
  • An old jeweler’s trick could change nuclear timekeeping
    A team of physicists has discovered a surprisingly simple way to build nuclear clocks using tiny amounts of rare thorium. By electroplating thorium onto steel, they achieved the same results as years of work with delicate crystals — but far more efficiently. These clocks could be vastly more precise than current atomic clocks and work […]

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Futuristic illustration of microchips, a silicon wafer, and 3D chip stacks representing the nanoelectronics era, with the text "Scaling beyond 100nm" and "Nanoelectronics Era" in bold letters.
Scaling beyond 100nm – Nanoelectronics Era
As silicon and silicon dioxide reach their scaling limits, engineers turn to high-k materials, metal gates, and new device architectures like FinFETs and SOI. These...
Abstract visualization of microelectronic scaling trends, showing chip layers, wafers, and nanostructures representing technological progress from larger nodes to nanoscale devices.
Scaling of CMOS: Microelectronics era
As CMOS technology shrank below 1 μm in the microelectronics era, high electric fields caused reliability issues like hot carrier effects. Techniques such as LATID...
Illustration showing CMOS scaling progression, highlighting reduced transistor sizes and technological milestones in the sub-100nm nanoelectronics era.
Scaling of CMOS and its Issues
Dennard scaling revolutionized microelectronics by showing that reducing transistor size and voltage proportionally keeps power density constant. However, real-world limitations like subthreshold slope and interconnect...
Fig 18. Several steps more can be done to complete several metal layers for interconnects. The last step in the process is the deposition of the final passivation layer, usually Si3N4 (silicon nitride), deposited by PECVD.
CMOS Process Steps: 3um to 1.25um
CMOS chips are made using a twin-well process, with precise tailoring of each well starting from a lightly doped substrate. Key production steps include using...
Illustration of the nMOS fabrication process steps visualized as a factory layout, including substrate selection, device isolation, ion implantation, gate formation, and metallization.
Basic nMOS Technology: Process Steps
NMOS fabrication involves key process steps like substrate selection, isolation, gate formation, and metallization. LOCOS isolation prevents unwanted current flow, while polysilicon gates enhance process...
Illustration representing extrinsic semiconductors, showing doped silicon structures with labeled donor or acceptor atoms.
The Physics and Technology of Extrinsic Semiconductors
Doping modifies a semiconductor by introducing donor or acceptor atoms, increasing free electron or hole concentration. This creates an n-type or p-type material, shifting the...