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Scaling of CMOS and its Issues
Dennard scaling revolutionized microelectronics by showing that reducing transistor size and voltage proportionally keeps power density constant. However, real-world limitations like subthreshold slope and interconnect...
CMOS Process Steps: 3um to 1.25um
CMOS chips are made using a twin-well process, with precise tailoring of each well starting from a lightly doped substrate. Key production steps include using...
Basic nMOS Technology: Process Steps
NMOS fabrication involves key process steps like substrate selection, isolation, gate formation, and metallization. LOCOS isolation prevents unwanted current flow, while polysilicon gates enhance process...
The Physics and Technology of Extrinsic Semiconductors
Doping modifies a semiconductor by introducing donor or acceptor atoms, increasing free electron or hole concentration. This creates an n-type or p-type material, shifting the...
The Physics and Technology of Intrinsic Semiconductors
Semiconductors are materials with electrical properties between metals and insulators, governed by their band structure. The valence and conduction bands define electron movement, with a...
Majoranas: The Next Step in Quantum Computing
Microsoft’s Azure Quantum team is developing quantum chips using topological qubits, leveraging Majorana zero modes for stability. Their research on superconducting nanowires could accelerate quantum...
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