Longreads
Semiconductor Packaging Technology
Wire bonding and flip-chip packaging represent two fundamental approaches to chip interconnection. While wire bonding offers simplicity and cost benefits, flip-chip allows ...
Scaling beyond 100nm – Nanoelectronics Era
As silicon and silicon dioxide reach their scaling limits, engineers turn to high-k materials, metal gates, and new device architectures like FinFETs ...
Scaling of CMOS: Microelectronics era
As CMOS technology shrank below 1 μm in the microelectronics era, high electric fields caused reliability issues like hot carrier effects. Techniques such ...
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Beyond Conductivity: Advanced Metal Science
Explore the advanced physics of metals beyond conductivity. Learn about superconductivity, AC conductivity, and electromagnetic interactions.
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